Sense Envelope III

The project investigates how materials can be developed and designed to react strategically based on the local thermal environment. This allows architectural envelopes to respond to microclimatic conditions, operating solely on the solar radiation and ambient air temperatures. Studies include computational design processes, material and fabrication studies, leading to a large-scale demonstrator located at the Danish Architecture Center in Copenhagen. The project was supported by Realdania.

Architectural, material and process results have been presented at the Design Modeling Symposium International Conference and published by Springer Verlag with the title “Thermal Responsive Envelope- Computational Assembling Behavioural Composites by Additive and Subtractive Processes” and the architectural journal Arkitekten.

Research, development, documentation and dissemination of the project Sense, third generation, a dynamic responsive architectural envelope based on articulated material dynamics. AREA (2014) A.Pasold and I.W.Foged. Acknowledgement We would like to thank the Realdania Foundation for the financial support making it possible to develop and construct the third generation prototype. Furthermore, we like to thank the Danish Architectural Center for hosting the project at the harbour front in central Copenhagen. We also like to thank Henrik Olsen for the precision of the wooden structure construction and the care to craftsmanship. And a special thanks to civil engineer Kasper Worre Foged, who developed and implemented the microprocessor and sensor network for the registration and logging of the thermal environment in the prototype.

Type Building Envelope Research and Design

Year 2015

Photos, Drawings, Simulations, Graphs Pasold Foged Architects