Sense Envelope III

The project investigates how materials can be developed and designed to react strategically based on the local thermal environment. This allows architectural envelopes to respond to microclimatic conditions, operating solely on the solar radiation and ambient air temperatures. Studies include computational design processes, material and fabrication studies, leading to a large-scale demonstrator located at the Danish Architecture Center in Copenhagen. The project was supported by Realdania.

Architectural, material and process results have been presented at the Design Modeling Symposium International Conference and published by Springer Verlag with the title “Thermal Responsive Envelope- Computational Assembling Behavioural Composites by Additive and Subtractive Processes” and the architectural journal Arkitekten. 

Type Building Envelope Research and Design

Year 2015

Photos, Drawings, Simulations, Graphs Pasold Foged Architects